服务支持

Support

封装信息

  • BGA(ball grid array )
  • PGA(butt joint pin grid array)
  • BQFP(quad flat package with bumper)
  • PGA(butt joint pin grid array)
  • CLCC(ceramic leaded chip carrier)
  • COB(chip on board)
  • DFP(dual flat package)
  • DSO(dual small out-lint)
  • DICP(dual tape carrier package)
  • DIP(dual tape carrier package)
  • FQFP(fine pitch quad flat package)
  • CPAC(globe top pad array carrier)
  • CQFP(quad fiat package with guard ring)
  • JLCC(J-leaded chip carrier)
  • LCC(Leadless chip carrier)
  • LGA(land grid array)
  • LQFP(low profile quad flat package)
  • MCM(multi-chip module
  • MFP(mini flat package
  • MQFP(metric quad flat package)
  • MSP(mini square package)
  • OPMAC(over molded pad array carrier)
  • PCLP(printed circuit board leadless package)
  • PFPF(plastic flat package)
  • PGA(pin grid array)
  • PLCC(plastic teadless chip carrier)(plastic leaded chip currier)
  • QFH(quad flat high package)
  • QFI(quad flat I-leaded packgac)
  • QFJ(quad flat J-leaded package)
  • QFN(quad flat non-leaded package)
  • QFP(quad flat package)
  • QIC(quad in-line ceramic package)
  • QTCP(quad tape carrier package)
  • QTP(quad tape carrier package
  • SDIP (shrink dual in-line package)
  • SH-DIP(shrink dual in-line package)
  • SMD(surface mount devices)
  • SOI(small out-line I-leaded package)
  • SOIC(small out-line integrated circuit)
  • SOJ(Small Out-Line J-Leaded Package
  • SQL(Small Out-Line L-leaded package)
  • SONF(Small Out-Line Non-Fin)
  • SOF(small Out-Line package)
  • SOW (Small Outline Package(Wide-Jype))
Tel: 86-755-83002020 E-mail:manager@tyitl.com
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